68 ? nic components corp. www .niccomp. com www .lowesr. com www .rfpassives. com www .smtmagnetics. com stacked film capacitor chips nspu series features ? stacked metallized acrylic resin film (thermo-cure type) ? standard eia 0805, 1206 and 1210 sizes ? high heat and moisture resistant ? stable temperature, frequency & bias characteristics ? reflow soldering only ? tape and reel packaging environmental characteristics nspu 104 m 16 tr a3 f rohs compliant size code tape & reel voltage tolerance code: m=20% capacitance in pf, 1st two digits are signi? cant, 3rd digit is no. of zeros series part number system nspu is recommended for new designs specifications case sizes 0805 1206 1210 capacitance range 0.1 f 0.15 f ~ 0.068 f 1.0 f voltage ratings 16vdc capacitance tolerance 20% (m) temperature range -40c ~ +85c dissipation factor (20c) 1.5% @ 1khz/25c insulation resistance (20c) c < 0.33 f = 1000m , c > 0.47 f = 300m / f @ 10vdc dielectric withstanding voltage 175% of rated voltage (5 seconds) 150% of rated voltage (60 seconds) temperature characteristic -20% ~ +5% c maximum over temperature range life test at +85c 1,000 hours at 125% of rated voltage capacitance change within +7% ~ -20% of initial value dissipation factor 1.65% maximum @ 1khz insulation resistance c < 0.33 f = 300m min., c > 0.47 f = 100m / f resistance to soldering heat re? ow: 240c peak capacitance change within +3% ~ -15% of initial value dissipation factor 1.65% maximum ~ 1khz insulation resistance c < 0.33 f = 500m min., c > 0.47 f = 150m / f withstanding voltage 150% of rated voltage for 60 seconds 175% of rated voltage for 5 seconds humidity load life +40c & 90% ~ 95% rh 500 hours @ rated voltage capacitance change within +20%/-3% of initial value dissipation factor 2.25% maximum insulation resistance c < 0.33 f = 100m min., c > 0.47 f = 30m / f withstanding voltage 130% of rated voltage for 60 seconds solderability with 25% wt rosin-methanol flux 90% minimum coverage after 2.5 second dip into 245c solder pot rohs compliant includes all homogeneous materials *see part number system for details
69 ? nic components corp. www .niccomp. com www .lowesr. com www .rfpassives. com www .smtmagnetics. com stacked film capacitor chips nspu series standard values and case sizes (mm) tape and reel dimensions (mm) t 1.75 0.1 w 1.5 +0.1 -0 4.0 0.1 p 1 f a d o b c p land pattern dimensions (mm) 13.0 +/? 0.5 d2 d1 d3 reel w 2.0 +/- 0.5 2.0 +/? 0.5 t c a b stacked element terminations: l 1 h w p p l 2 95.5% sn, 4% ag and 0.5% cu over phenolic resin/ag/ni/cu barrier over cu base. eia size a 0.1 b 0.1 c 0.2 0805 1.55 2.3 1.3 1206 1.9 3.5 1.5 1210 1.9 3.5 1.9 part number capacitance value dimensions (mm) eia size reel qty l 0.2 w 0.2 h 0.2 p NSPU104M16TRA3F 0.1 f 2.0 1.25 1.0 0.45 0.25 0805 3,000 nspu154m16trb4f 0.15 f 3.2 1.6 0.8 0.65 0.30 1206 3,000 nspu224m16trb4f 0.22 f 0.8 1206 3,000 nspu334m16trb5f 0.33 f 1.0 1206 3,000 nspu474m16trb6f 0.47 f 1.4 1206 2,000 nspu684m16trb6f 0.68 f 1.4 1206 2,000 nspu105m16trc4f 1.0 f 2.5 1.4 1210 2,000 case code a 0.1 b 0.1 c 0.2 t 0.05 w 0.3 f 0.05 p 0.1 d +0.2/-0 a3 1.55 2.3 1.3 0.25 8.0 3.5 4.0 1.0 b4, b5 1.9 3.5 1.5 b6 1.9 3.5 1.9 c4 2.8 3.5 1.9 recommended reflow profile peak temperature 240c 50 100 150 200 250 300 time temperature - deg. c pre-heat 150c ~ 180c 120 sec. max. 25 0 cool down time above 220c 30 sec. max. ramp-up 25c ~ 150c 90 sec. max. note: these capacitors are sensitive to moisture. capacitors should be stored in moisture barrier packaging at +25c and a relative humidity of <70% (six months maximum). the components should be soldered within 72 hours of breaking the moisture barrier packaging seal and stored during those 72 hours at <+25c and <70% relative humidity. if the parts are to be storage outside of the moisture barrier packaging the conditions should be <+20c and relative humidity of less then 50%.
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